It is the only machine processing in the production process. 3 different types of wafer cutting equipment are equipped, which can simultaneously and continuously provide the raw material needed for workshop production, and adjust the size parameters of the parts according to the production requirements.
Processing quantity display
Processing precision parameters
MPO products grinding
Grinding machine specially equipped for the process
Packaging workshop of raw material testing machine
Chip end face detection
The introduction of 2 sets of international advanced numerical control equipment
