1. Home
  2. Manufacturing Equipment
  3. PLC Wafer and MPO Connector Workshop
PLC Wafer and MPO Connector Workshop
  • Wafer cutting process
    Wafer cutting process
  • Dicing saw
    Dicing saw

It is the only machine processing in the production process. 3 different types of wafer cutting equipment are equipped, which can simultaneously and continuously provide the raw material needed for workshop production, and adjust the size parameters of the parts according to the production requirements.

  • Processing quantity display
    Processing quantity display
  • Processing precision parameters
    Processing precision parameters
  • MPO products grinding
    MPO products grinding
  • Grinding machine specially equipped for the process
    Grinding machine specially equipped for the process
  • Packaging workshop of raw material testing machine
    Packaging workshop of raw material testing machine
  • Chip end face detection
    Chip end face detection
  • The introduction of 2 sets of international advanced numerical control equipment
    The introduction of 2 sets of international advanced numerical control equipment
  • Automatic completion of micro parts processing
    Automatic completion of micro parts processing

Shenzhen Xinhaixun Photoelectricity Co., Ltd.

Contactperson: Wu Haiping
Tel.: +86-755-33517577
Mobile: +8613418780981
Fax: +86-755-33517477
E-mail: haiping.wu@xinhaixun.com